霸刀分享-又三个金刚石半导体新项目，省重点研发！
霸刀分享-又三个金刚石半导体新项目，湖南省重点研发！
近日，湖南省科学技术厅对2025年度湖南省重点研发计划拟立项项目进行了公示。在此次公示中，三家企业所申报的超硬材料项目成功“突围”，跻身重点研发项目拟立项之列，充分彰显出湖南超硬材料产业的创新活力。
“超宽禁带半导体金刚石 CVD 制备与掺杂技术研发”项目的负责人为曹晓君，牵头申报单位是湖南良诚新材料科技有限公司，专业生产经营CVD培育钻石及半导体材料，并在该领域实现了设备制造和产品生产的垂直整合；
“高性能低成本金刚石铜材料制备研究与芯片封装应用开发”项目的负责人为伍水平，牵头申报单位是湖南新锋先进材料科技有限公司，技术源起为中南大学气相沉积技术与薄膜材料研究室，主要通过气相沉积技术从事半导体材料、生态健康材料、光电声热力功能材料的研发生产和应用；
“高性能低成本金刚石铜材料制备研究与芯片封装应用开发”项目的负责人为王志勇，牵头申报单位是长沙博朗思达新材料科技有限公司，该公司专注于金属基复合材料研发与生产，核心产品包括新能源IGBT铜铝复合带材等，2024年获评湖南省制造业单项冠军企业。
湖南省重点研发计划是湖南省省级科技创新计划7大类别之一，突出技术支撑，面向制约湖南高新技术、现代农业、社会发展等领域的关键核心共性技术，以及“卡脖子”技术，从基础前沿、技术攻关到应用示范进行全链条创新设计、一体化组织实施。据了解，立项项目主要采取前资助支持方式，经费支持额度为每项50万元－150万元。
Ba Dao Sharing-Three more new diamond semiconductor projects, key research and development in Hunan Province!
Recently, the Department of Science and Technology of Hunan Province has made public the proposed projects to be funded under the Hunan Provincial Key Research and Development Program in 2025. In this public announcement, the super-hard materials projects submitted by three enterprises successfully "broke through" and were included in the list of proposed key research and development projects, fully demonstrating the innovative vitality of Hunan's super-hard materials industry.
The project leader of "Research and Development of CVD Preparation and Doping Technology for Ultra-Wide Bandgap Semiconductor Diamond" is Cao Xiaojun. The leading applicant is Hunan Liangcheng New Materials Technology Co., LTD., which specializes in the production and operation of CVD cultivated diamonds and semiconductor materials, and has achieved vertical integration of equipment manufacturing and product production in this field.
The project leader of "Research on Preparation of High-Performance and Low-Cost Diamond-Copper Materials and Application Development for Chip Packaging" is Wu Shuiping. The leading applicant is Hunan Xinfeng Advanced Materials Technology Co., LTD. The technology originated from the Vapor Deposition Technology and Thin Film Materials Laboratory of Central South University. Mainly engaged in the research and development, production and application of semiconductor materials, ecological health materials, and photoelectric acoustic thermal functional materials through vapor deposition technology.
The project leader of "Research on Preparation of High-Performance and Low-Cost Diamond Copper Materials and Application Development for Chip Packaging" is Wang Zhiyong. The leading applicant is Changsha Bolangsida New Materials Technology Co., LTD., which focuses on the research and development and production of metal matrix composites. Its core products include copper-aluminum composite strips for new energy IGBTs, etc. In 2024, it was awarded the title of "Single Champion Enterprise in Hunan Province's Manufacturing Industry".
The Key Research and Development Program of Hunan Province is one of the seven major categories of provincial-level scientific and technological innovation plans in Hunan. It emphasizes technical support and focuses on key core common technologies and "bottleneck" technologies that restrict the development of high-tech, modern agriculture, and society in Hunan. It conducts full-chain innovative design and integrated organization and implementation from basic frontiers, technological breakthroughs to application demonstrations. It is understood that the approved projects mainly adopt the pre-funding support method, with the funding support amount ranging from 500,000 to 1.5 million yuan for each project.